| Company's name: | HongKong Polytechnic UniversityBegin and end date: 2008-10- | | Enterprise nature: | InstitutionIndustry: Academic / Research | | Job Title: | Research Staff | | Job description: | Independently Research and Develop technology in the field of PCB fabrication and relevant application. Such as the subject: Gas application in the PCB fabrication process-Plasma treatment. Brand new material development in the field of PCB industrial, etc. | | Reasons for leaving: | | | | Company's name: | ViasystemsBegin and end date: 2006-09-2008-10 | | Enterprise nature: | Soly foreign funded enterprisesIndustry: Communication/Telecom/Network Equipment | | Job Title: | Senior Material Engineer | | Job description: | Work as leverage to Purchasing Dept, Sales Dept and Product Engineering Dept in terms of any issues revelant to Materials, like material recommendation for various applicaitons, highlight some key processes for new trial, etc.
Be familiar with all different kinds of laminate and prepreg, such as products from Isola, MEW, ITEQ, EMC, TUC, Grace, etc. Know about their thermal and electrical properties very well. Furthermore,I could make a best selection of which material to be used in lead-free application,as well as in anti-CAF applicaiton etc.
Sometimes help people from quality Dept to find a root cause of some types of problems as de-lamination, warpage, CAF issue etc.
Anyway, I am working in this field while learning in the same time. | | Reasons for leaving: | |
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